Complementary Materials

Complementary Materials

Our supporting materials consist of three main product categories: substrate resin, adhesion promoter and anti-sticking agent.

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Product Description

Substrate Resin

It is a UV-curable acrylate-based optical resin, specially developed for the fabrication of sub-masters via nanoimprint lithography. Featuring excellent filling performance, it can precisely replicate the micro/nano structures of the master template.

Adhesion Promoter

This product effectively improves the adhesion between nanoimprint resin and various substrates including glass, silicon wafers and resins. It is compatible with both spin-coating and spray coating processes.

Anti-sticking Agent

It can form a nano-scale anti-adhesion coating on the surface of silicon-based and glass molds. It delivers outstanding performances such as excellent anti-sticking property, easy demolding and convenient cleaning.

Technical Parameters

Substrate Resin

Status Test Item Units NPR2103E Test Method
Before Curing Viscosity cps 200-400 Viscometer at 25℃
Solid Content % >99 Solid Content Tester
Curing Conditions Curing Energy / UV-LED 365nm,200mw/cm²
Curing Process Spin Coating / 1000rpm/S,45S
Baking /
After Curing Water Contact Angle >105 Water Contact Angle Tester at 25℃
Light Transmittance % >99 Spectrophotometer (365 nm)
Haze % 0.50±0.05% Haze Meter
Hardness Shore D 51D Shore D Durometer
Abrasion Resistance
Applicable Substrates
Adhesion Promoter

Status Test Item Units NP1301B DT–10–2 Test Method
Before Curing Viscosity cps <5 1~3 Viscometer
Solid Content % 3±0.5 Solid Content Tester
Curing Conditions Curing Energy /
Curing Process Spin Coating / 4000rpm, 30s 2500rpm, 35s(<100nm)
Baking / 80℃, 3mins (Hotplate) 70℃, 2 mins
(Hot Plate or Oven)
After Curing Water Contact Angle
Light Transmittance %
Haze %
Hardness Shore D
Abrasion Resistance
Applicable Substrates Glass, Silicon Wafers Resin wafers
Anti-sticking Agent

Status Test Item Units NP1302A Test Method
Before Curing Viscosity cps
Solid Content % 0.5-0.6 100℃1h
Curing Conditions Curing Energy /
Curing Process Spin Coating / Post Spin Treatment 80℃ 2h/ 150℃ 1h
Baking /
After Curing Water Contact Angle ≥112 Water Contact Angle Tester
Light Transmittance %
Haze %
Hardness Shore D
Abrasion Resistance ≥1000 1kg Wear Tester
Applicable Substrates Silicon Wafer, Glass, Metal

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