Nanoimprint Etching Resin

Nanoimprint Etching Resin

Applicable for etching various substrates including Si,SiO₂ ,TiO₂ , Cr and sapphire glass. It adopts acrylic or epoxy resin systems, featuring fast curing speed and excellent coating performance. Customized R&D solutions are available to meet customer-specific requirements.

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Technical Parameters 

Status Test Item Units SE303A TX-KS005C TX-KS007A
Before Curing Solvent PGMEA PGMEA PGMEA Dilutable
Viscosity cps <10 <14
Solid Content % 50±3 20±3 100
Film Forming Process Coating Method Refer to spin-coating curve 2500~4000rpm, 35s
(hotplate) 200~500nm
Inkjet
Pre-bake 80℃, 2min (hotplate) 60~80℃, 2min (hotplate)
UV Curing N2, 365nm UV-LED
600mw/cm²
N2, 365nm UV-LED
200-300mw/cm², 180s
N2, 365nm UV-LED
80mw/cm², 6s
After Curing Appearance Transparent
Curing Shrinkage Rate % <5 <8 <9
Etching Substrate Sapphire Si , Cd
Etch Selectivity 0.8 Si 1.7-2.0,Cd 0.4

Product Features 

● Capable of spin coating

Withstand vacuum environment

 Tolerate high-temperature baking

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We will respond to your inquiries via email within 24 hours.